Iichips zinokudibanisa amacandelo amaninzi e-elektroniki kwibhodi ye-silicon ukwenza isekethe, ngaloo ndlela ifezekisa umsebenzi othile. Kuhlala kukho iipateni ezithile, amanani, njl njl kumphezulu wetshiphu yokuchonga okanye eminye imisebenzi. Kungenxa yoko le nto imarike kufuneka ikwazi ukwenza uphawu oluchanekileyo kunye neenkcukacha ze-chip laser kwindawo encinci yemathiriyeli ngaphandle kokutshabalalisa iipropathi ezisebenzayo zechip.
Umatshini wokumakisha we-IC chip laser unokuchaneka okuphezulu. Isekelwe kwi-mechanical positioning kwaye idibanisa inkqubo yokucwangcisa umfanekiso kunye nekhadi lokucubungula umfanekiso wedijithali njengento engundoqo, inkqubo yokunyakaza elawulwa yikhadi lokulawula ukuhamba kwe-multi-axis kunye ne-laser galvanometer ukuskena ubuchwepheshe obulawulwa yikhadi le-DSP ukufezekisa i-IC chip. uphawu lwe-laser lufuna ukuchaneka okuphezulu kunye nesantya esiphezulu.
Umatshini wokumakisha we-laser oveliswe ngu-JINZHAO unokukrola ngokucacileyo kuzo zonke izinto zetsimbi kunye nezingezona zetsimbi, azisoze zanyamalala (ukunxiba okungeyomzimba), angonakalisi izinto, kwaye azichaphazeli umsebenzi wemveliso. Luhlobo lwe-laser coding, i-laser engraving, i-laser Indlela yokucubungula i-laser inokuphawula imodeli, uphawu lwe-CE, inombolo ye-serial kunye nolunye ulwazi oluluncedo kubathengisi kumphezulu we-IC chip, eququzelela ukuchongwa kokulandeleka kunye nokuchasana ne-counterfeiting, kwaye ukubhala kucacile kwaye akuyi kulimaza i-chip IC.
Nceda uqhagamshelane nathi ngeenkcukacha ezithe vetshe.